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this is information on a product in full production. january 2013 doc id 024162 rev1 1/13 13 ESDARF01-1BF4 esd protection for am and fm antenna datasheet ? production data features single line bidirectional protection very low capacitance (1.2 pf max) lead-free package very low capacitance, line to ground, for optimized data integrity low pcb space consumption: 0.18 mm 2 max no insertion loss in am and fm band high reliability offered by monolithic integration complies with the following standards iec 61000-4-2: ? 15 kv (air discharge) ? 8 kv (contact discharge) mil std 883g- method 3015-7: class 3b applications where transient over voltage protection in esd sensitive equipment is required, such as: portable audio systems communication systems cellular phone handsets and accessories audio and video equipment description the ESDARF01-1BF4 is a monolithic application specific device dedicated to esd protection of the am and fm antenna in cell phones and portable equipment. the device is ideal for applications where both reduced printed circuit board space and power absorption capability are required. figure 1. functional diagram 0201 flip chip www.st.com
characteristics ESDARF01-1BF4 2/13 doc id 024162 rev1 1 characteristics figure 2. electrical characteristics (definitions) table 1. absolute maximum ratings symbol parameter value unit v pp (1) peak pulse voltage iec 61000-4-2 contact discharge iec 61000-4-2 air discharge 10 15 kv t j maximum operating junction temperature 125 c t stg storage temperature range - 55 to +150 c t l maximum lead temperature for soldering during 10 s at 5 mm for case 260 c 1. for a surge greater than the maximum val ues, the diode will fail in short-circuit. v i v cl v cl v br v br v rm v rm i rm i pp slope: 1/r d symbol parameter v = breakdown voltage v = stand-off voltage v = clamping voltage i = peak pulse current br rm cl pp i = leakage current @ v rm rm table 2. electrical characteristics (values, t amb = 25 c) symbol parameter test conditions value unit min. typ. max. v br breakdown voltage i r = 1 ma 0.6 0.8 1.0 v i rm leakage current v rm = 100 mv 50 na c i/o-gnd capacitance between i/o and gnd v r = 0 v, f = 1 mhz, any i/o pin to gnd 1.2 pf
ESDARF01-1BF4 characteristics doc id 024162 rev1 3/13 figure 3. dynamical resistance measurements figure 4. s21 attenuation measurements (50 ? / 50 ? ) i pp (a ) 0 5 10 15 20 25 0 5 10 15 reverse forward v cl (v) db 100k 1m 10m 100m 1g 10g -6 -5 -4 -3 -2 -1 0 s/db f/hz ESDARF01-1BF4 f (hz) figure 5. esd response to iec 61000-4-2 (+8 kv contact discharge) figure 6. esd response to iec 61000-4-2 (-8 kv contact discharge) 20 v/div v : peak clamping voltage v :clamping voltage at 30 ns v :clamping voltage at 60 ns v :clamping voltage at 100 ns cl cl cl cl 1 2 3 4 115.4 v 1 6.8 v 2 8.7 v 2.1 v 4 3 2 20 ns/div 20 v/div v : peak clamping voltage v :clamping voltage at 30 ns v :clamping voltage at 60 ns v :clamping voltage at 100 ns cl cl cl cl 1 2 3 4 -116.2 v 1 -5 v -10.4 v 3 -4.4 v 2 4 20 ns/div
characteristics ESDARF01-1BF4 4/13 doc id 024162 rev1 figure 7. junction capacitance versus reverse applied voltage (typical values) figure 8. junction capacitance versus frequency (typical values) f=1 mhz v r =0 to 300mv v osc =30mv rms t j =25 c direct / reverse c (pf) v (v) r 0.0 0.1 0.05 0.0 0.2 0.4 0.6 0.8 1.0 c (pf) 0.0 0.2 0.4 0.6 0.8 1.0 1 10 100 1000 f = 1 mhz to 3 ghz v osc = 30 mv rms t j = 25 c direct / reverse f (mhz)
ESDARF01-1BF4 application schematics doc id 024162 rev1 5/13 2 application schematics figure 9. application schematics 270 nh 100 nf to fm rf input of the fm module to reference of earpieces (audio amplifier) to bottom connector, reference of the earpieces and fm antenna esdarf01 - 1bf4 fm receiver when the reference of earpieces (audio amplifier) is different from 0 v 270 nh to fm rf input of the fm module to bottom connector, reference of the earpieces and fm antenna esdarf01 - 1bf4 fm receiver when the reference of earpieces (audio amplifier) is 0 v to fm rf input of the fm module ESDARF01-1BF4 fm receiver 270 nh 100 nf to reference of earpieces (audio amplifier) to bottom connector, reference of the earpieces and fm antenna whatever the reference of earpieces (audio amplifier)
ordering information scheme ESDARF01-1BF4 6/13 doc id 024162 rev1 3 ordering information scheme figure 10. ordering information scheme esda rf 01 - 1b f4 esd protection device application package f4 = 0201 flip chip rf antenna b = bi-directional number of lines directional
ESDARF01-1BF4 package information doc id 024162 rev1 7/13 4 package information epoxy meets ul94, v0 lead-free package in order to meet environmental requirements, st offers these devices in different grades of ecopack ? packages, depending on their level of environmental compliance. ecopack ? specifications, grade definitions and product status are available at: www.st.com . ecopack ? is an st trademark. figure 11. 0201 flip chip dimension definitions table 3. 0201 flip chip dimension values ref. dimensions millimeters inches min. typ. max. min. typ. max. a 0.28 0.30 0.32 0.0110 0.0118 0.0126 b 0.19 0.21 0.23 0.0075 0.0082 0.0091 b1 0.125 0.14 0.155 0.0049 0.0055 0.0061 b2 0.125 0.14 0.155 0.0049 0.0055 0.0061 d 0.57 0.60 0.63 0.0224 0.0236 0.0257 e 0.33 0.35 0.37 0.0130 0.0138 0.0146 e 0.27 0.30 0.33 0.0106 0.0118 0.0130 l1 0.175 0.19 0.205 0.0069 0.0075 0.0081 l2 0.175 0.19 0.205 0.0069 0.0075 0.0081 top view bottom view side view d e a l2 l1 b1 b b2 e
package information ESDARF01-1BF4 8/13 doc id 024162 rev1 figure 12. marking note: the marking codes can be rotated by 90 or 180 to differentiate assembly location.in no case should this product marking be used to orient the component for its placement on a pcb. only pin 1 mark is to be used for this purpose. figure 13. tape and reel specification pin1 pin2 r user direction of unreeling all dimensions in mm 4.0 0.1 2.0 0.05 8.0 +0.3 -0.01 2.0 0.05 1.75 0.1 3.5 - 0.05 ? 1.5 0.1 0.36 0.03 0.38 0.03 0.68 0.03
ESDARF01-1BF4 recommendation on pcb assembly doc id 024162 rev1 9/13 5 recommendation on pcb assembly 5.1 stencil opening design 1. general recommendation on stencil opening design a) stencil opening dimensions: l (length), w (width), t (thickness). figure 14. stencil opening dimensions b) general design rule stencil thickness (t) = 75 ~ 125 m 2. reference design a) stencil opening thickness: 100 m b) stencil opening for leads: opening to footprint ratio is 60% to 75%. figure 15. recommended stencil window position l t w aspect ratio w t ----- 1.5 ? = aspect area lw ? 2t l w + ?? --------------------------- - 0.66 ? = solder opening solder lands sencil opening 190 m 240 m 300 m 250 m 350 m 25 m 110 m 200 m 250 m x x : from 50 to 120 m , depend s on pcb supplier capability
recommendation on pcb assembly ESDARF01-1BF4 10/13 doc id 024162 rev1 5.2 solder paste 1. use halide-free flux, qualification rol0 according to ansi/j-std-004. 2. ?no clean? solder paste recommended. 3. offers a high tack force to resist component displacement during pcb movement. 4. use solder paste with fine particles: powder particle size 20-45 m. 5.3 placement 1. manual positioning is not recommended. 2. it is recommended to use the lead recognition capabilities of the placemen t system, not the outline centering. 3. standard tolerance of 0.05 mm is recommended. 4. 3.5 n placement force is recommended. too much placement force can lead to squeezed out solder paste and cause solder joints to short. too low placement force can lead to insufficient contact between package and solder paste that could cause open solder joints or badly centered packages. 5. to improve the package placement accuracy, a bottom side optical control should be performed with a high resolution tool. 6. for assembly, a perfect supporting of the pcb (all the more on flexible pcb) is recommended during solder paste printing, pick and place and reflow soldering by using optimized tools. 5.4 pcb design preference 1. to control the solder paste amount, the closed via is recommended instead of open vias. 2. the position of tracks and open vias in the solder area should be well balanced. the symmetrical layout is recommended, in case any tilt phenomena caused by asymmetrical solder paste amount due to the solder flow away.
ESDARF01-1BF4 recommendation on pcb assembly doc id 024162 rev1 11/13 5.5 reflow profile figure 16. st ecopack ? recommended soldering reflow profile for pcb mounting note: minimize air convection currents in the reflow oven to avoid component movement. 250 0 50 100 150 200 240 210 180 150 120 90 60 30 300 270 - 6c/s 240-245 c 2 - 3 c/s temperature (c) -2 c/s -3 c/s time (s) 0.9 c/s 60 sec (90 max)
ordering information ESDARF01-1BF4 12/13 doc id 024162 rev1 6 ordering information 7 revision history table 4. ordering information order code marking package weight base qty delivery mode ESDARF01-1BF4 r 0201 flip chip 0.116 mg 15000 tape and reel table 5. document revision history date revision changes 16-jan-2013 1 first issue
ESDARF01-1BF4 doc id 024162 rev1 13/13 please read carefully: information in this document is provided solely in connection with st products. stmicroelectronics nv and its subsidiaries (?st ?) reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described he rein at any time, without notice. all st products are sold pursuant to st?s terms and conditions of sale. purchasers are solely responsible for the choice, selection and use of the st products and services described herein, and st as sumes no liability whatsoever relating to the choice, selection or use of the st products and services described herein. no license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted under this document. i f any part of this document refers to any third party products or services it shall not be deemed a license grant by st for the use of such third party products or services, or any intellectual property contained therein or considered as a warranty covering the use in any manner whatsoev er of such third party products or services or any intellectual property contained therein. unless otherwise set forth in st?s terms and conditions of sale st disclaims any express or implied warranty with respect to the use and/or sale of st products including without limitation implied warranties of merchantability, fitness for a parti cular purpose (and their equivalents under the laws of any jurisdiction), or infringement of any patent, copyright or other intellectual property right. unless expressly approved in writing by two authorized st representatives, st products are not recommended, authorized or warranted for use in milita ry, air craft, space, life saving, or life sustaining applications, nor in products or systems where failure or malfunction may result in personal injury, death, or severe property or environmental damage. st products which are not specified as "automotive grade" may only be used in automotive applications at user?s own risk. resale of st products with provisions different from the statements and/or technical features set forth in this document shall immediately void any warranty granted by st for the st product or service described herein and shall not create or extend in any manner whatsoev er, any liability of st. st and the st logo are trademarks or registered trademarks of st in various countries. information in this document supersedes and replaces all information previously supplied. the st logo is a registered trademark of stmicroelectronics. all other names are the property of their respective owners. ? 2013 stmicroelectronics - all rights reserved stmicroelectronics group of companies australia - belgium - brazil - canada - china - czech republic - finland - france - germany - hong kong - india - israel - ital y - japan - malaysia - malta - morocco - philippines - singapore - spain - sweden - switzerland - united kingdom - united states of america www.st.com

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